BondCheck
The BondCheck is a bond tester for finding disbonds and delamination in composite and honeycomb structures, supplied in Malaysia by Asia NDE.
Multi-mode bond testing flaw detector offering pitch-catch, resonance and MIA modes for disbond and delamination detection in composite, honeycomb and metallic bonded structures.
Overview
Key advantages
- Multi-mode bond testing – pitch-catch, resonance and MIA.
- Quick set-up, including air calibration in resonance mode.
- Lightweight and portable.
- Dry coupled pitch-catch and MIA probes.
- Automatic test frequency optimisation.
- Ideal for metallic bonded structures, composites and honeycomb.
Overview
The BondCheck tests bonds in three modes. All three share one user interface in a single lightweight instrument, so set-up is simple. It can be used in the lab, in the hangar or outdoors. The large 14.5cm (5.7”) 640 x 480 daylight readable colour screen can be split or inset with X-Y spot, frequency sweep, RF waveform and spectrum displays.
Probes
- Pitch-catch probe – CNC machined aluminium with rubber grips, adjustable feet, interchangeable rounded or flat tips, broadband 30kHz operation, alarm LED and digital ID with stored settings. A smaller form factor is available for tight areas.
- MIA probe – dry coupled Mechanical Impedance Analysis for honeycomb and composite structures.
- Resonance probes – supplied in kits for laminate and bonded structure inspection.
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